Interfacial reaction and growth behavior of reaction layer of Si₃N₄/Si₃N₄ joint brazed by Cu-Zn-Ti filler alloy

À´Ô´ÆÚ¿¯£ºÖйúÓÐÉ«½ðÊôѧ±¨(Ó¢ÎÄ°æ)2005ÄêµÚz2ÆÚ

ÂÛÎÄ×÷ÕߣºÕÅ½Ü ÖÜÓñ M. Naka

ÎÄÕÂÒ³Â룺261 - 265

Key words£ºSi₃N₄ ceramic£» Cu-Zn-Ti filler alloy£» interfacial reaction£» kinetic

Abstract: Si₃N₄ ceramic was jointed to itself using a filler alloy of Cu-Zn-Ti by the reaction between Ti and Si₃N₄. The microstructure of the interface in the joint is found to be Si₃N₄ ceramic/TiN reaction layer/Ti₅Si₃ reaction layer. The grain size of the TiN and Ti₅Si₃ reaction layer is 0.1¤@¦Ìm and 1-2¤@¦Ìm, respectively. There is no crystal orientation relationship between TiN reaction layer and Si₃N₄ ceramic or Ti₅Si₃ reaction layer. The kinetic equation for calculating the thickness of the reaction layer was obtained. When a £¨CuZn£©85Ti15 alloy is used as the filler alloy, the apparent activation energy of the growth of the reaction layer is 201.69¤@kJ/mol.