热处理对Cu-Cr(-Zr)合金力学性能和导电性能的影响
来源期刊：中国有色金属学报2000年第5期
论文作者：廖素三 尹志民 蒋牵 姜锋 宋练鹏 汪明朴
文章页码：684 - 687
关键词：Cu-Cr合金； Cu-Cr-Zr合金； 热处理；显微组织
Key words：Cu-Cr alloy; Cu-Cr-Zr alloy; heat treatments; microstructures
摘 要：制备了CuCr和Cu-Cr-Zr二种合金板材，研究了不同热处理工艺对合金的显微组织、力学性能和导电性能的影响。结果表明，在本实验条件下， Cu-0.5Cr合金经960 ℃, 1 h固溶和450 ℃, 20 h时效后，抗拉强度为363 MPa， 屈服强度为274 MPa， 延伸率为22%， 电导率达81%IACS； 添加微量Zr到Cu-0.5Cr合金中，在不降低合金延伸率情况下， 合金强度可提高50 MPa， 但电导率降低约10%IACS。
Abstract: Cu-0.5Cr and Cu-0.5Cr-0.2Zr alloy plates were prepared. The effects of heat treatment on microstructure, mechanical properties and electrical conductivity have been studied. The results show that under 960 ℃, 1h solution treating and 450 ℃, 20 h aging condition, the tensile strength, yield strength, elongation and electrical conductivity of Cu-0.5Cr alloy can reach 363 MPa, 274 MPa, 22% and 81%IACS respectively. Adding 0.2%Zr to Cu-0.5Cr alloy, the tensile strength and yield strength of the alloy increase by about 50 MPa. However, under this condition the electrical conductivity of the alloy decreases by 10%IACS.
