热处理对Cu-Cr(-Zr)合金力学性能和导电性能的影响
来源期刊:中国有色金属学报2000年第5期
论文作者:廖素三 尹志民 蒋牵 姜锋 宋练鹏 汪明朴
文章页码:684 - 687
关键词:Cu-Cr合金; Cu-Cr-Zr合金; 热处理;显微组织
Key words:Cu-Cr alloy; Cu-Cr-Zr alloy; heat treatments; microstructures
摘 要:制备了CuCr和Cu-Cr-Zr二种合金板材,研究了不同热处理工艺对合金的显微组织、力学性能和导电性能的影响。结果表明,在本实验条件下, Cu-0.5Cr合金经960 ℃, 1 h固溶和450 ℃, 20 h时效后,抗拉强度为363 MPa, 屈服强度为274 MPa, 延伸率为22%, 电导率达81%IACS; 添加微量Zr到Cu-0.5Cr合金中,在不降低合金延伸率情况下, 合金强度可提高50 MPa, 但电导率降低约10%IACS。
Abstract: Cu-0.5Cr and Cu-0.5Cr-0.2Zr alloy plates were prepared. The effects of heat treatment on microstructure, mechanical properties and electrical conductivity have been studied. The results show that under 960 ℃, 1h solution treating and 450 ℃, 20 h aging condition, the tensile strength, yield strength, elongation and electrical conductivity of Cu-0.5Cr alloy can reach 363 MPa, 274 MPa, 22% and 81%IACS respectively. Adding 0.2%Zr to Cu-0.5Cr alloy, the tensile strength and yield strength of the alloy increase by about 50 MPa. However, under this condition the electrical conductivity of the alloy decreases by 10%IACS.