简介概要

Solidification behavior of SiCw/Al-18Si composites

来源期刊:Rare Metals2007年第S1期

论文作者:WEI Hongmei,GENG Lin,and ZHANG Xuexi School of Materials Science and Engineering,Harbin Institute of Technology,Harbin ,China

文章页码:237 - 241

摘    要:SiCw/Al-18Si composites were prepared by squeeze casting technique.Solidification behavior of SiCw/Al-18Si composites was studied by differential scanning calorimeter(DSC) and scanning electron microscopy(SEM).The re-melting temperature has little effect on the solidification behavior and microstructure of composites.With the increase of SiC whisker content,onset and peak temperatures of primary Si decrease and the average size of primary silicon becomes smaller and smaller.Sr addition lowers onset and peak temperatures of primary Si,however,onset and peak temperatures of eutectic were barely affected by Sr addition.The average sizes of primary Si and Al-Si eutectic both decrease by Sr addition.

详情信息展示

Solidification behavior of SiCw/Al-18Si composites

WEI Hongmei,GENG Lin,and ZHANG Xuexi School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China

摘 要:SiCw/Al-18Si composites were prepared by squeeze casting technique.Solidification behavior of SiCw/Al-18Si composites was studied by differential scanning calorimeter(DSC) and scanning electron microscopy(SEM).The re-melting temperature has little effect on the solidification behavior and microstructure of composites.With the increase of SiC whisker content,onset and peak temperatures of primary Si decrease and the average size of primary silicon becomes smaller and smaller.Sr addition lowers onset and peak temperatures of primary Si,however,onset and peak temperatures of eutectic were barely affected by Sr addition.The average sizes of primary Si and Al-Si eutectic both decrease by Sr addition.

关键词:

<上一页 1 下一页 >

有色金属在线官网  |   会议  |   在线投稿  |   购买纸书  |   科技图书馆

中南大学出版社 技术支持 版权声明   电话:0731-88830515 88830516   传真:0731-88710482   Email:administrator@cnnmol.com

互联网出版许可证:(署)网出证(京)字第342号   京ICP备17050991号-6      京公网安备11010802042557号