表面组装焊点内部应力—应变场的数值模拟(Ⅰ)——应力—应变场分布特征及其动态特性
来源期刊：中国有色金属学报2000年第3期
论文作者：马鑫 钱乙余 吉田综仁
文章页码：404 - 410
关键词：温度循环载荷； 表面组装焊点； 应力—应变场；动态特性； 有限元数值模拟
Key words：temperature cycling load； surface mount solder joints； stress-strain field； dynamic feature； finite element numerical simulation
摘 要：针对表面组装焊点的实际服役条件， 对温度循环载荷下其内部应力—应变场的分布特征进行了有限元数值模拟。结果表明，温度循环在焊点内部导致应力循环，应力循环导致热棘轮效应，即非弹性应变累积；在温度历史过程中， 应力—应变场等值分布图呈现动态特性， 且与温度历史相关。
Abstract: Based on the real service conditions of surface mount solder joints, the finite element numerical simulation was made in order to get the feature of stressstrain distribution in the solder joints under temperature cycling. Analysis results show that temperature cycling leads to stress cycling and the later leads to thermal ratchetting effect and the accumulation of inelastic strain. Furthermore, stressstrain distribution in the solder joints has dynamic feature during temperature cycling and is related to temperature history.
