高强高导Cu合金在干滑动条件下的磨损性能

来源期刊:中国有色金属学报(英文版)2015年第7期

论文作者:高 原 接金川 张鹏超 张 剑 王同敏 李廷举

文章页码:2293 - 2300

关键词:铜合金;接触导线;滑动磨损;质量损失;磨损机理;电子显微形貌

Key words:copper alloys; contact wire; sliding wear; mass loss; wear mechanism; electron microstructure

摘    要:为了研究不同类型接触线的磨损行为,对由上引连铸及连续挤压方法制备的Cu-Sn, Cu-Ag 和 Cu-Mg合金的干滑动磨损行为进行分析。该实验在环块式摩擦磨损试验机上进行。结果表明:由连续氧化物膜组成的表面层对摩擦因数有显著影响。在实验过程中观察到的主要磨损机制有磨粒磨损、粘着磨损、氧化磨损和塑性变形。在较低的摩擦速度和载荷下氧化磨损和磨料磨损是主要的磨损机制;随着载荷和摩擦速度的增加氧化磨损和粘着磨损起主要作用;而在较高的速度和载荷下,塑性变形则成为主要的磨损机制。

Abstract: In order to study the wear behavior of different kinds of contact wires, the dry sliding wear behaviors of Cu-Sn, Cu-Ag and Cu-Mg alloys prepared by up-drawn continuous casting and followed continuous extrusion were studied. The research was tested on a block-on-ring wear tester. The results indicate that the friction coefficient is remarkably influenced by the formation of a continuous tribofilm, which consists of oxidation film. The abrasion, adhesion, oxidation and plastic deformation are observed. Oxidation and abrasion wear mechanisms dominate at the lower sliding velocity and load. The combination of oxidation and adhesion play leading roles with the increasing load and velocity. Plastic deformation is detected under higher applied load and sliding velocities.

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