Corrosion electrochemical mechanism of chemical mechanical polishing ofcopper in K₃Fe(CN)₆ solution

来源期刊：中国有色金属学报(英文版)2002年第1期

论文作者：何捍卫 胡岳华 黄可龙

文章页码：178 - 182

Key words：copper; polishing rate; corrosion current density

Abstract: Polarization curves of copper were measured in NH₃·H₂O media containing K₃Fe(CN)₆.Components of passive film were analyzed by XPS.Relation of polishing rate with corrosion current density was investigated during CMP.Copper can bepassivated in the slurry and main component of passive film is Cu₄Fe(CN)₆. Relation of polishing rate with corrosion current density is linear direct ratio and expressed as R=KJ_corr during CMP.Coefficient K varies with different slurry systems but is constant under experimental conditions,which does not vary with NH₃·H₂O,K₃Fe(CN)₆,γ-Al₂O₃ concentrations, polishing pressures and rotative rate in aslurry system during CMP.