电子封装陶瓷基片材料的研究进展

来源期刊:中国有色金属学报2010年第7期

论文作者:李婷婷 彭超群 王日初 王小锋 刘兵

文章页码:1365 - 1374

关键词:电子封装材料;Al2O3陶瓷;AlN陶瓷;BeO陶瓷;SiC陶瓷;Si3N4陶瓷;流延成型;凝胶注模成型

Key words:electronic packaging materials; alumina ceramics; AlN ceramics; beryllium ceramics; silicon carbide ceramics; silicon nitride ceramics; tape casting; gel-casting

摘    要:总结微电子封装技术对封装基片材料性能的要求,论述Al2O3、AlN、BeO、SiC和Si3N4陶瓷基片材料的特点及其研究现状,其中AlN陶瓷基片的综合性能最好。分析轧膜、流延和凝胶注模薄片陶瓷成型工艺的优缺点,其中水基凝胶注模成型工艺适用性较强;指出陶瓷基片材料和薄片陶瓷成型工艺的发展趋势。

Abstract: The elemental requirements for electronic packaging substrate materials are summarized. The characteristics of alumina, aluminum nitride, beryllium, silicon carbide, silicon nitride ceramics substrates used for electronic packaging and the recent research achievements of the electronic packaging ceramic substrate materials are discussed, the aluminum nitride has the best comprehensive properties among them. The advantages and disadvantages of tape calendaring, tape casting, gel-casting technologies for forming thin ceramics are analyzed, gel-casting in which has relatively strong applicability. The development trends of ceramic substrate materials and forming technologies are pointed out.

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