Two-stage Hall-Petch relationship in Cu with recrystallized structure
来源期刊：JOURNAL OF MATERIALS SCIENCE TECHNOLOG2020年第13期
论文作者：Y.Z.Tian Y.P.Ren S.Gao R.X.Zheng H.C.Pan Z.F.Zhang N.Tsuji G.W.Qin
文章页码：31 - 35
摘 要：Although Cu was studied extensively, the Hall-Petch relationship was mainly reported in the coarsegrained regime. In this work, fully recrystallized Cu specimens with a wide grain size regime of 0.51–14.93μm manifest a two-stage Hall-Petch relationship. There is a critical grain size of 3 μm that divides stages Ⅰ and Ⅱwhere the Hall-Petch slope k value are quite different. The stage Ⅱ is supposed to be validified down to 100 nm at least by comparing with a Cu-Ag alloy. The critical grain size varies in different materials systems, and the underline mechanisms are discussed based on the dislocation glide modes.
Y.Z.Tian1，Y.P.Ren2，S.Gao3,4，R.X.Zheng5，H.C.Pan1，Z.F.Zhang7,8，N.Tsuji3,4，G.W.Qin2
1. Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), School of Materials Science and Engineering, Northeastern University2. State Key Laboratory of Rolling and Automation, Northeastern University3. Department of Materials Science and Engineering, Kyoto University4. Elements Strategy Initiative for Structural Materials (ESISM), Kyoto University5. Key Laboratory of Aerospace Advanced Materials and Performance of Ministry of Education, School of Materials Science and Engineering, Beihang University7. Laboratory of Fatigue and Fracture for Materials, Institute of Metal Research, Chinese Academy of Sciences8. School of Materials Science and Engineering, University of Science and Technology of China
摘 要：Although Cu was studied extensively, the Hall-Petch relationship was mainly reported in the coarsegrained regime. In this work, fully recrystallized Cu specimens with a wide grain size regime of 0.51–14.93μm manifest a two-stage Hall-Petch relationship. There is a critical grain size of 3 μm that divides stages Ⅰ and Ⅱwhere the Hall-Petch slope k value are quite different. The stage Ⅱ is supposed to be validified down to 100 nm at least by comparing with a Cu-Ag alloy. The critical grain size varies in different materials systems, and the underline mechanisms are discussed based on the dislocation glide modes.
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