Al/Sn二元扩散偶相界面扩散溶解层的形成机理
来源期刊：中国有色金属学报2013年第3期
论文作者：马会宇 竺培显 周生刚 韩朝辉
文章页码：816 - 821
关键词：Al/Sn；扩散偶；界面；扩散溶解层；形成机理
Key words：Al/Sn; diffusion couple; interphase; diffusion solution layer; forming mechanism
摘 要：采用层片式扩散偶制备技术制备Al/Sn扩散偶，在不同热压温度条件下进行热处理，利用金相显微镜、扫描电镜、能谱仪、XRD衍射仪等研究Al/Sn扩散偶扩散溶解层的形貌特征与形成机理。结果表明：在0.5 MPa和230 ℃烧结条件下，Sn元素优先沿Al晶界扩散，然后沿其表面扩散；随着扩散时间的延长，Al与Sn元素间扩散和溶解程度增大，界面区无新物相生成，最终形成由Al和Sn的离异合金组织组成的界面过渡层且呈锯齿状形态分布；Al/Sn界面冶金结合是Al和Sn固相扩散、溶解与结晶共同作用的结果。
Abstract: The diffusion couples of Al/Sn were prepared by laminating diffusion couple technology, and then treated for different holding times. The appearance characteristics and forming mechanism of Al/Sn diffusion solution layer were investigated by the metallographic microscope, SEM, EDS and X-ray diffractometry. The results show that, under sintering conditions of 230 ℃ and 0.5 MPa, Sn element spreads along Al grain boundary preferentially, and then spreads along Al substrate. With the increase of the diffusion time, there exist strong elemental diffusion and dissolution between Sn and Al. Finally, there are no new phases formed at the interface. The interface transition layer, which is in the sawteeth shape, consists of Al and Sn divorced alloy. The formation of metallurgical bonding interface comes from the solid phase diffusion, dissolution and crystallization between Al and Sn.
马会宇，竺培显，周生刚，韩朝辉
(昆明理工大学 材料科学与工程学院，昆明 650093)
摘 要：采用层片式扩散偶制备技术制备Al/Sn扩散偶，在不同热压温度条件下进行热处理，利用金相显微镜、扫描电镜、能谱仪、XRD衍射仪等研究Al/Sn扩散偶扩散溶解层的形貌特征与形成机理。结果表明：在0.5 MPa和230 ℃烧结条件下，Sn元素优先沿Al晶界扩散，然后沿其表面扩散；随着扩散时间的延长，Al与Sn元素间扩散和溶解程度增大，界面区无新物相生成，最终形成由Al和Sn的离异合金组织组成的界面过渡层且呈锯齿状形态分布；Al/Sn界面冶金结合是Al和Sn固相扩散、溶解与结晶共同作用的结果。
关键词：Al/Sn；扩散偶；界面；扩散溶解层；形成机理
MA Hui-yu, ZHU Pei-xian, ZHOU Sheng-gang, HAN Chao-hui
(Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China)
Abstract:The diffusion couples of Al/Sn were prepared by laminating diffusion couple technology, and then treated for different holding times. The appearance characteristics and forming mechanism of Al/Sn diffusion solution layer were investigated by the metallographic microscope, SEM, EDS and X-ray diffractometry. The results show that, under sintering conditions of 230 ℃ and 0.5 MPa, Sn element spreads along Al grain boundary preferentially, and then spreads along Al substrate. With the increase of the diffusion time, there exist strong elemental diffusion and dissolution between Sn and Al. Finally, there are no new phases formed at the interface. The interface transition layer, which is in the sawteeth shape, consists of Al and Sn divorced alloy. The formation of metallurgical bonding interface comes from the solid phase diffusion, dissolution and crystallization between Al and Sn.
Key words:Al/Sn; diffusion couple; interphase; diffusion solution layer; forming mechanism
