简介概要

Preparation and characterization of molybdenum powders with copper coating by the electroless plating technique

来源期刊:Rare Metals2008年第4期

论文作者:WANG Guangjun and WANG Dezhi School of Materials Science and Engineering, Central South University, Changsha , China

文章页码:434 - 438

摘    要:Molybdenum powders with a diameter of approximately 3 μm were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75°C. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values of pH and temperature were found to be 12.5 and 60°C, respectively, which at-tributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to mi-crostructural studies using scanning electron microscope (SEM) and the phases were analyzed using X-ray diffraction (XRD). An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.

详情信息展示

Preparation and characterization of molybdenum powders with copper coating by the electroless plating technique

摘要:Molybdenum powders with a diameter of approximately 3 μm were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75°C. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values of pH and temperature were found to be 12.5 and 60°C, respectively, which at-tributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to mi-crostructural studies using scanning electron microscope (SEM) and the phases were analyzed using X-ray diffraction (XRD). An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.

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