Evaluation on the interface characteristics, thermal conductivity, and annealing effect of a hot-forged Cu-Ti/diamond composite
来源期刊：JOURNAL OF MATERIALS SCIENCE TECHNOLOG2020年第14期
论文作者：Lei Lei Yu Su Leandro Bolzoni Fei Yang
文章页码：7 - 14
摘 要：A Cu-1.5 wt.%Ti/Diamond（55 vol.%） composite was fabricated by hot forging from powder mixture of copper, titanium and diamond powders at 1050?C. A nano-thick Ti C interfacial layer was formed between the diamond particle and copper matrix during forging, and it has an orientation relationship of（111）Ti C//（002）Cu&[1 1 0]Ti C//[1 1 0]Cuwith the copper matrix. HRTEM analysis suggests that Ti C is semicoherently bond with copper matrix, which helps reduce phonon scattering at the Ti C/Cu interface and facilitates the heat transfer, further leading to the hot-forged copper/diamond composite（referred as to Cu-Ti/Dia-0） has a thermal conductivity of 410 W/m K, and this is about 74% of theoretical thermal conductivity of hot-forged copper/composite（552 W/m K）. However, the formation of thin amorphous carbon layer in diamond particle（next to the interfacial Ti C layer） and deformed structure in the copper matrix have adverse effect on the thermal conductivity of Cu-Ti/Dia-0 composite. 800?C-annealing eliminates the discrepancy in Ti C interface morphology between the diamond-{100} and-{111} facets of Cu-Ti/Dia-0 composite, but causes Ti C particles coarsening and agglomerating for the Cu-Ti/Dia-2 composite and interfacial layer cracking and spallation for the Cu-Ti/Dia-1 composite. In addition, a large amount of graphite was formed by titanium-induced diamond graphitization in the Cu-Ti/Dia-2 composite. All these factors deteriorate the heat transfer behavior for the annealed Cu-Ti/Dia composites. Appropriate heat treatment needs to be continually investigated to improve the thermal conductivity of hot-forged CuTi/Dia composite by eliminating deformed structure in the copper matrix with limit/without impacts on the formed Ti C interfacial layer.
Lei Lei，Yu Su，Leandro Bolzoni，Fei Yang
Waikato Centre for Advanced Materials and Manufacturing, School of Engineering, University of Waikato
摘 要：A Cu-1.5 wt.%Ti/Diamond（55 vol.%） composite was fabricated by hot forging from powder mixture of copper, titanium and diamond powders at 1050?C. A nano-thick Ti C interfacial layer was formed between the diamond particle and copper matrix during forging, and it has an orientation relationship of（111）Ti C//（002）Cu&[1 1 0]Ti C//[1 1 0]Cuwith the copper matrix. HRTEM analysis suggests that Ti C is semicoherently bond with copper matrix, which helps reduce phonon scattering at the Ti C/Cu interface and facilitates the heat transfer, further leading to the hot-forged copper/diamond composite（referred as to Cu-Ti/Dia-0） has a thermal conductivity of 410 W/m K, and this is about 74% of theoretical thermal conductivity of hot-forged copper/composite（552 W/m K）. However, the formation of thin amorphous carbon layer in diamond particle（next to the interfacial Ti C layer） and deformed structure in the copper matrix have adverse effect on the thermal conductivity of Cu-Ti/Dia-0 composite. 800?C-annealing eliminates the discrepancy in Ti C interface morphology between the diamond-{100} and-{111} facets of Cu-Ti/Dia-0 composite, but causes Ti C particles coarsening and agglomerating for the Cu-Ti/Dia-2 composite and interfacial layer cracking and spallation for the Cu-Ti/Dia-1 composite. In addition, a large amount of graphite was formed by titanium-induced diamond graphitization in the Cu-Ti/Dia-2 composite. All these factors deteriorate the heat transfer behavior for the annealed Cu-Ti/Dia composites. Appropriate heat treatment needs to be continually investigated to improve the thermal conductivity of hot-forged CuTi/Dia composite by eliminating deformed structure in the copper matrix with limit/without impacts on the formed Ti C interfacial layer.
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