The New Plating Process on Plastics
来源期刊：材料热处理学报2004年第5期
论文作者：Kazuya Satoh Jun Okada Makoto Imamura
关键词：plating on plastics; plating process; recycling; regulation to phosphorus and nitrogen;
摘 要：This process does not use general electroless plating solution containing formaldehyde(carcinogen) and phosphate(the object of waste water regulation). Furthermore, we succeeded in developing a new electroless copper plating solution which is usable semi-permanently by using the special reducing agent. The electroless deposition forms a very thin conductive film on substrate. Therefore, it can prevent some appearance defects (e.g. pits, pin-holes, laminations and inclusions) that occur in the conventional ones. In addition, it is possible to eliminate electroplating of copper from the process by applying the exclusive nickel solution in electroplating. Therefore, the obtained metal parts can be recycled as high quality stainless steel. Given this copper electroplating-free process, 25μ m-thick nickel deposition at the stage of electroplating, at least, enables the metal layers to show properties as versatile as those of the conventional(its total thickness is 25μ m in the comparative conventional process).
Kazuya Satoh1，Jun Okada1，Makoto Imamura1
(1.Okuno Chemical Industries Co.,Ltd, Japan)
摘要:This process does not use general electroless plating solution containing formaldehyde(carcinogen) and phosphate(the object of waste water regulation). Furthermore, we succeeded in developing a new electroless copper plating solution which is usable semi-permanently by using the special reducing agent. The electroless deposition forms a very thin conductive film on substrate. Therefore, it can prevent some appearance defects (e.g. pits, pin-holes, laminations and inclusions) that occur in the conventional ones. In addition, it is possible to eliminate electroplating of copper from the process by applying the exclusive nickel solution in electroplating. Therefore, the obtained metal parts can be recycled as high quality stainless steel. Given this copper electroplating-free process, 25μ m-thick nickel deposition at the stage of electroplating, at least, enables the metal layers to show properties as versatile as those of the conventional(its total thickness is 25μ m in the comparative conventional process).
关键词:plating on plastics; plating process; recycling; regulation to phosphorus and nitrogen;
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