Microstructural Evaluation of 410 SS/Cu Diffusion-Bonded Joint
来源期刊：JOURNAL OF MATERIALS SCIENCE TECHNOLOG2010年第2期
论文作者：H. Sabetghadam A. Zarei Hanzaki A. Araee A. Hadian
文章页码：163 - 169
摘 要：In the present study, a grade of stainless steel （SS, 410） and copper plates were joined through diffusion bonding by using a nickel interlayer at temperature range of 800-950℃. These were performed through pressing the specimens under a pressure of 12 MPa for 60 min under 1.33×10 -2 Pa （10-4 torr） vacuum. The microstructure and phase constitution near the diffusion bonding interface of Cu/Ni and Ni/SS were studied by optical microscopy （OM）, scanning electron microscopy （SEM）, X-ray diffraction （XRD） and an elemental analyses through energy dispersive spectrometry （EDS）. The results indicated that an obvious diffusion zone was formed near both Cu/Ni and Ni/SS interfaces during the vacuum diffusion bonding. The thickness of reaction layer in both interfaces was increased with increasing process temperature. The diffusion transition region near the Cu/Ni and Ni/SS interfaces consist of complete solid solution zone and various phases based on （Fe, Ni）, （Fe, Cr, Ni） and （Fe, Cr）, respectively. From EDS results, three different mixtures of phases were distinguished in SS-Ni interface. The activation energy and rate constant were determined for the growth of these reaction layers and the values become maximum for the {γFe, Ni+αFe+Cr} phase mixture.
H. Sabetghadam1，A. Zarei Hanzaki1，A. Araee2，A. Hadian1
1. School of Metallurgical and Materials Engineering,University of Tehran2. School of Mechanical Engineering,University of Tehran
摘 要：In the present study, a grade of stainless steel （SS, 410） and copper plates were joined through diffusion bonding by using a nickel interlayer at temperature range of 800-950℃. These were performed through pressing the specimens under a pressure of 12 MPa for 60 min under 1.33×10 -2 Pa （10-4 torr） vacuum. The microstructure and phase constitution near the diffusion bonding interface of Cu/Ni and Ni/SS were studied by optical microscopy （OM）, scanning electron microscopy （SEM）, X-ray diffraction （XRD） and an elemental analyses through energy dispersive spectrometry （EDS）. The results indicated that an obvious diffusion zone was formed near both Cu/Ni and Ni/SS interfaces during the vacuum diffusion bonding. The thickness of reaction layer in both interfaces was increased with increasing process temperature. The diffusion transition region near the Cu/Ni and Ni/SS interfaces consist of complete solid solution zone and various phases based on （Fe, Ni）, （Fe, Cr, Ni） and （Fe, Cr）, respectively. From EDS results, three different mixtures of phases were distinguished in SS-Ni interface. The activation energy and rate constant were determined for the growth of these reaction layers and the values become maximum for the {γFe, Ni+αFe+Cr} phase mixture.
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