Cu75Pt25钎料钎焊GH99和Nb焊接接头的界面组织及力学性能

来源期刊:中国有色金属学报(英文版)2020年第10期

论文作者:李文强 胡胜鹏 雷玉珍 雷煜 宋晓国 冯吉才

文章页码:2724 - 2736

关键词:镍基高温合金;铌;Cu75Pt25钎料;钎焊;显微组织;力学性能

Key words:nickel-based superalloy; Nb; Cu75Pt25 filler; brazing; microstructure; mechanical properties

摘    要:采用Cu75Pt25钎料对GH99高温合金与Nb合金进行焊接,通过调节焊接参数获得良好的钎焊接头。钎焊接头的典型界面显微组织结构为Nb/Nb7Ni6+NbNi3/Ni(s,s)+富Cr NbNi3+(NbCr2+NbNi3)/GH99。分析钎焊温度和保温时间对GH99/Cu75Pt25/Nb接头界面显微组织的影响。结果表明,GH99合金中Ni原子向液态钎料的溶解和扩散对界面组织演化起着至关重要的作用。随着钎焊温度的升高,Nb-Ni反应层将取代原来生成的Nb3Pt化合物层,且其厚度先增大,然后保持不变。1150 °C保温15 min时,所得钎焊接头的最大抗剪强度为152 MPa;接头均呈现脆性断裂模式,断裂位置由Nb3Pt层向Nb-Ni化合物层转变。

Abstract: Cu75Pt25 brazing filler was applied to brazing GH99 superalloy to Nb, and the sound joints were obtained by adjusting brazing parameters. The typical interfacial microstructure of the brazed joint was Nb/Nb7Ni6+NbNi3/ Ni(s,s)+Cr-rich NbNi3+(NbCr2+NbNi3)/GH99. The effects of brazing temperature and holding time on the interfacial microstructure of GH99/Cu75Pt25/Nb joints were studied. The results showed that the solution and diffusion of Ni atoms from GH99 substrate into brazing seam played a critical role in the interfacial microstructure evolution. As the brazing temperature rose, the Nb-Ni reaction layer was formed instead of the initial Nb3Pt layer, and the thickness increased firstly and then remained constant. The highest shear strength of the joint reached 152 MPa when brazed at 1150 °C for 15 min. All of the joints presented a brittle fracture mode during shear test, and the fracture location changed from Nb3Pt layer to Nb-Ni compounds layer.

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