Surface alloying of Cu with Ti by double glow discharge process
来源期刊：中国有色金属学报(英文版)2004年第3期
论文作者：袁庆龙 池成忠 苏永安 徐重 唐宾
文章页码：516 - 519
Key words：titanizing; Cu-Ti alloying layer; double glow discharge process
Abstract: The surface of pure copper alloyed with Ti using double glow discharge process was investigated. The morphology, structure and forming mechanism of the Cu-Ti alloying layer were analyzed. The microhardness and wear resistance of the Cu-Ti alloying layer were measured, and compared with those of pure copper. The results indicate that the surface of copper activated by Ar and Ti ions bombardment is favorable to absorption and diffusion of Ti element. In current experimental temperature, as the Ti content increases, the liquid phase occurs between the deposited layer and diffused layer, which makes the Ti ions and atoms easy to dissolve and the thickness of Cu-Ti alloying layer increase rapidly. After cooling, the structure of the alloying layer is composed of CuTi, Cu4Ti and Cu(Ti) solid solution. The solid solution strengthening and precipitation strengthening effects of Ti result in high surface hardness and wear resistance.
