Thermal expansion and mechanical properties of high reinforcement content SiC_p/Cu composites fabricated by squeeze casting technology

来源期刊：中国有色金属学报(英文版)2009年增刊第3期

论文作者：陈国钦 修子扬 孟松鹤 武高辉 朱德志

文章页码：600 - 604

Key words：SiC_p/Cu composites; electronic packaging; thermal expansion coefficient; mechanical properties

Abstract: High reinforcement content SiC_p/Cu composites (φ_p=50%, 55% and 60%) for electronic packaging applications were fabricated by patent cost-effective squeeze-casting technology. The composites appear to be free of pores, and the SiC particles are distribute uniformly in the composites. The mean linear coefficients of thermal expansion (CTEs, 20-100 ℃) of as-cast SiC_p/Cu composites range from 8.8×10^{-6 ℃-1} to 9.9×10^{-6 ℃-1} and decrease with the increase of SiC content. The experimental CTEs of as-cast SiC_p/Cu composites agree well with the predicted values based on Kerner model. The CTEs of composites reduce after annealing treatment due to the fact that the internal stress of the composite is released. The Brinell hardness increases from 272.3 to 313.2, and the modulus increases from 186 GPa to 210 GPa for the corresponding composites. The bending strength is larger than 374 MPa, but no obvious trend between bending strength and SiC_p content is observed.

基金信息：China Postdoctoral Science Foundation
the High-tech Research and Development Program of Harbin City, China