Fabrication and thermo-physical properties ofTiB_2p/Cu composites for electronic packaging applications

来源期刊：中国有色金属学报(英文版)2009年增刊第2期

论文作者：陈国钦 修子扬 孟松鹤 武高辉 朱德志

文章页码：448 - 452

Key words：TiB_2p/Cu composites; densification; coefficient of thermal expansion; thermal conductivity

Abstract: TiB_2p/Cu composites with high reinforcement content (φ_p=50%, 58% and 65%) for electronic packaging applications were fabricated by squeeze casting technology. The microstructures and thermo-physical properties of the TiB_2p/Cu composites were investigated. The results show that TiB₂ particles are homogeneous and distribute uniformly, and the TiB₂-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers, the densifications of the TiB_2p/Cu composites are higher than 98.2%. The mean linear coefficients of thermal expansion at 20-100 ℃ for TiB_2p/Cu composites range from 8.3×10^-6 to 10.8×10^-6/K and decrease with increasing volume fraction of TiB₂. The experimental coefficients of thermal expansion agree well with the predicted values based on Turner’s model. The thermal conductivities of TiB_2p/Cu composites range from 167.3 to 215.4 W/(m·K), decreasing with increasing volume fraction TiB₂.

基金信息：China Postdoctoral Science Foundation
the Special Fund of Technological Innovation of Harbin, China