Factors governing heat affected zone during wire bonding

来源期刊：中国有色金属学报(英文版)2009年增刊第2期

论文作者：孙立宁 刘曰涛 刘延杰

文章页码：490 - 494

Key words：heat affected zone; wire bonding; electric flame off; free air ball

Abstract: In the wire bonding process of microelectronic packaging, heat affect zone (HAZ) is an important factor governing the loop profile of bonding. The height of loop is affected by the length of the HAZ. Factors governing the HAZ were studied. To investigate this relationship, experiments were done for various sizes of wire and free air ball (FAB). Electric flame-off (EFO) current, EFO time, EFO gap and recrystallization were also studied. The results show that as the size of FAB becomes larger, the length of HAZ increases. With the increase of EFO current and time, the length of HAZ becomes longer. When FAB forms at the same parameter the length of HAZ becomes shorter with the high temperature of recrystallization.

基金信息：the National Natural Science Foundation of China
the National High-Tech Research and Development Program of China