Cu-Ni-Si-P合金的动态再结晶

来源期刊：中国有色金属学报2008年第7期

论文作者：张毅 田保红 陈小红 贾淑果 任凤章 龙永强

文章页码：1241 - 1241

关键词：Cu-2.0Ni-0.5Si-0.03P合金；热压缩变形；动态再结晶；本构方程

Key words：Cu-2.0Ni-0.5Si-0.03P alloy; hot compression deformation; dynamic recrystallization; constitutive equation

摘    要：

Abstract: The flow stress behavior of Cu-2.0Ni-0.5Si-0.03P alloy during hot compression deformation was studied by isothermal compression test at Gleeble-1500D thermal-mechanical simulator at the temperature ranging from 600 ℃ to 800 ℃ and at the strain rate from 0.01 /s to 5 /s. The results show that the flow stress is controlled by both strain rate and deforming temperature, the flow stress decreases with increasing deforming temperature, while increases with increasing strain rate. When the deformation temperature is 750 and 800 ℃, the flow stress decreases after a peak value, showing continuous dynamic recrystallization. Both the hot deformation activation energy and constitutive equation were derived from the correlativity of flow stress, strain rate and temperature.

基金信息：国家高新技术研究发展计划资助项目
国家自然科学基金资助项目
河南省杰出青年基金资助项目